Editor's Note: Dalian Liancheng CNC Machine Co., Ltd. has considerable strength in multi-line cutting machine tools. Its cutting machine has been certified by the Photovoltaic Association as an international advanced technology level equipment. To this end, this article specializes in Dalian Liancheng CNC Machine Co., Ltd. senior engineer, Dalian outstanding inventor Zhang Shuli wrote this article.
With the progress of human society and the growing demand, energy has been the focus of the world as an important role in promoting the rapid development of society. Especially when people generally believe that the limited resources on the planet will end, the scientists have devoted a lot of energy to the field of seeking new energy. Such as hydropower, wind power, solar power, etc. In recent years, the application of solar energy has become more and more widespread. For this inexhaustible, inexhaustible solar energy, the eyes of all mankind are focused here, so that the wafer processing industry will also rise, so that photovoltaic products can be developed at a high speed. However, the processing requirements for silicon materials are also getting higher and higher. The cutting technology of ultra-thin silicon wafers breaks the traditional form of saw blade processing. The multi-line processing method is used to lead the trend of silicon wafer production today. Technology is currently the world's most advanced wafer processing technology.
Most of the photovoltaic industry production plants in China use foreign multi-line cutting machine tools, which is due to the fact that China's multi-line cutting machine tools are still in their infancy. At the beginning of 2011, the 5th International Solar Photovoltaic Conference was held at the Shanghai Exhibition Hall. There were many manufacturers of photovoltaic products at the show, while there were less than 10 multi-line processing machine tools for silicon materials. The Dalian International Liancheng CNC Machine Co., Ltd. exhibits an internationally advanced cutting machine (see Figure 1) that wins the favor of users and returns with a thick order. This allows us to see the prospects and future of domestic multi-line cutting machine tools, and the situation of completely relying on imports has been broken.
However, in terms of domestically produced multi-wire-cut silicon wafer machines, there is a big gap between similar products in advanced countries such as Switzerland and Japan, and many core technologies need to be studied.
Process and advantages of multi-line processing of silicon wafers
Wafers in photovoltaic and electronic products require a variety of processes. It is different in the manufacture of silicon ingots. The single crystal silicon is drawn from a single crystal furnace, the silicon ingot is cylindrical, and the polycrystalline silicon ingot is a square body. On a round side, the process of processing with a multi-wire cutting machine is different to achieve the final sheet. The single crystal silicon is cut first, that is, the head and tail are cut off, the square is cut, and finally sliced. Polysilicon is cut first, that is, the entire square silicon ingot is cut into dozens of small squares, then cut to the top and bottom, and finally sliced.
The use of multi-wire cutting silicon wafer has many advantages over traditional sawing: silicon wafer has small curvature, good parallelism, low surface roughness value, small thickness tolerance, less cutting loss between sheets, high slicing rate and high production efficiency. The return on investment is high. Therefore, the application of multi-wire cutting machine is an inevitable choice for the development of large-scale production and improvement of production efficiency, and is especially suitable for batch processing of ultra-thin substrates of solar photovoltaic cells.
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